Semiconductor and precision-engineering equipment require components with high stiffness, dimensional stability, and reliable thermal performance. Materials such as silicon carbide are well suited to these conditions, but their hardness makes conventional machining slow, costly, and material-intensive.

Binder jetting provides a near-net-shape route for producing wafer chucks, frames, brackets, and other precision components with integrated features. Reducing green machining helps lower material waste and processing time while preserving the geometric control required for demanding equipment.

After printing, the components can proceed to the required densification and finishing stages. This provides a more efficient manufacturing route for high-performance silicon carbide parts used in semiconductor and other precision systems.

High-density SiSiC

Dimensional stability, wear resistance and thermal shock resistance.

Up to 2 meters

Large and highly complex parts.

Fast turnaround

Green bodies in hours instead of weeks.

Tunable

Tunable mechanical properties.

Drop-in

Fits your current RBSiC post-processing equipment.

Application

Wafer chuck

Wafer chucks are critical components in semiconductor manufacturing, where silicon carbide (SiC) is valued for its hardness, thermal stability, and resistance to demanding process environments. However, these same material properties make conventional machining both slow and costly.

Using CONCR3DE Armadillo printer and high-density powder systems, SiC wafer chucks and other precision components can be produced without green machining. This eliminates a significant manufacturing step while reducing material waste and the processing time typically associated with machining SiC.

The resulting parts can move directly to post-processing stages such as silicon infiltration and chemical vapor infiltration (CVI), providing a more efficient route to manufacturing high-performance SiC components for semiconductor applications.

For higher production requirements, the same process can be implemented on the CONCR3DE Elephant platform, where the larger build area supports the production of more precision components within each print cycle.

Application

Bracket Kyo

SiC frames and brackets are used in high-precision equipment where stiffness, thermal stability, and positional accuracy are critical. Applications such as semiconductor lithography systems, electron microscopes, and coordinate measuring machines demand structural components that remain stable under changing operating conditions.

Using CONCR3DE Armadillo printer, near-net-shape SiC frames and brackets can be produced with integrated features, eliminating the need for extensive grinding. The resulting components combine high specific stiffness with near-zero thermal expansion and elevated resonant frequencies.

These material and structural properties support nanometre-level positional stability, making SiC an attractive solution for precision equipment where accuracy and repeatability are essential.

CONCR3DE Elephant platform extends this capability to higher-throughput production, allowing multiple precision components to be manufactured in one build while maintaining the same process control.

Application

Gyroid

Gyroid structures in siliconized silicon carbide (SiSiC) combine low material usage with a highly interconnected surface architecture. These characteristics make them well suited for applications such as heat exchangers and reactor components, where heat transfer, flow distribution, and thermal stability are critical.

Using CONCR3DE Armadillo printer, SiSiC gyroid structures can be produced as near-net-shape components with continuous internal surfaces and optimized surface-to-volume ratios. The resulting parts offer uniform flow paths and excellent resistance to thermal shock at temperatures exceeding 1000°C.

The technology enables the production of high-performance thermal processing components for demanding industrial environments, including chemical processing, concentrated solar energy, and other high-temperature applications.

On CONCR3DE Elephant platform, many gyroid components can be produced in a single build, supporting higher output for industrial thermal-processing applications.